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Rare coupling of magnetic and electric properties in a single material: New multiferroic mechanism could lead to next-generation memory and sensing devices

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TechAndComputer (July 25, 2011) — Researchers at the U.S. Department of Energy's Brookhaven National Laboratory have observed a new way that magnetic and electric properties -- which have a long history of ignoring and counteracting each other -- can coexist in a special class of metals. These materials, known as multiferroics, could serve as the basis for the next generation of faster and energy-efficient logic, memory, and sensing technology.

Th...

TechAndComputer (July 25, 2011) — Researchers at the U.S. Department of Energy's Brookhaven National Laboratory have observed a new way that magnetic and electric properties -- which have a long history of ignoring and counteracting each other -- can coexist in a special class of metals...

Discovery may overcome obstacle for quantum computing: Researchers find a way to quash decoherence

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TechAndComputer (July 20, 2011) — Researchers have made a major advance in predicting and quashing environmental decoherence, a phenomenon that has proven to be one of the most formidable obstacles standing in the way of quantum computing.

The findings -- based on theoretical work conducted at the University of British Columbia and confirmed by experiments at the University of California Santa Barbara -- are published online in the July 20 issue...

TechAndComputer (July 20, 2011) —...

Supercomputer: SDSC's Trestles provides rapid turnaround for diverse researchers

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TechAndComputer (July 14, 2011) — Trestles, a supercomputer launched earlier this year by the San Diego Supercomputer Center (SDSC) at the University of California, San Diego, is proving itself as a valuable resource for researchers across a wide range of disciplines, from astrophysics to molecular dynamics, who need access to computational resources with rapid turnaround.

In the seven months since its launch, more than 50 separate research...

TechAndComputer (July 14, 2011) — Trestles, a...

Soft memory device opens door to new biocompatible electronics

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TechAndComputer (July 14, 2011) — Researchers from North Carolina State University have developed a memory device that is soft and functions well in wet environments -- opening the door to a new generation of biocompatible electronic devices.

"We've created a memory device with the physical properties of Jell-O," says Dr. Michael Dickey, an assistant professor of chemical and biomolecular engineering at NC State and co-author of a paper...

TechAndComputer (July 14, 2011) — Researchers...

3-D integrated DRAM-on-logic for low-power mobile applications demonstrated

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TechAndComputer (July 12, 2011) — Imec and its 3-D integration partners have demonstrated the potential of 3-D integration of a commercial DRAM chip on top of a logic IC for next-generation low-power mobile applications. Imec's applied 3-D EDA (electronic design automation) tools including thermal models have proven to be valuable means to design next-generation 3-D stacked ICs.

The 3-D stack resembles as close as possible to future commercial...

TechAndComputer (July 12, 2011) — Imec and...